Senior Wireless Connectivity Firmware Engineer

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  • Annonce N° : 106211

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CONTEXT : NXP’s Wireless Connectivity group is building the next generation of wireless chipsets for Gaming, IoT, Industrial and Smart-Home devices. These chipsets will define ultra-low power, high performance and low latency benchmarks for products that rely on Wi-Fi, BT/BLE and IEEE 802.15.4. With more than 500M chips sold so far, the IEEE 802.15.4 is the predominant networking technology for the Internet of Things. The Zigbee protocol is already widely deployed and it will continue to grow. Its main applications are currently in the Smart-Home (set-top boxes, routers, smart lighting systems, connected camera, remote controls), in the Smart Metering (electric & gas meters) and in the Smart City (smart street lighting systems) domains. Meanwhile, the Connectivity Standard Alliance is currently working on a new Industry unifying standard called MATTER (based on THREAD) supported by the biggest tech. companies which will contribute to an even wider adoption of this technology in the near future. More than 1Billion IEEE 802.15.4 chips are forecasted to be sold each year from 2025 onwards! To become the #1 chip supplier in wireless connectivity for the IoT market, we are searching for the best talents over the world to create a new team dedicated to IEEE 802.15.4 SW development within our R&D competence center in CAEN. We plan to hire 15+ SW engineers by 2022. We are now looking for an experienced FW engineer ideally with a good background on wireless protocols. YOUR RESPONSIBILITIES : Within a newly created team of embedded SW development and SW validation engineers, you will specify, implement, unit test and maintain the IEEE 802.15.4 Firmware which is integrated into our multi-radio chipsets. You will write FW design specifications based on the software requirements and you will develop the corresponding standard-based or proprietary IEEE 802.15.4 SW features. You will contribute to the verification and validation of our SoCs during both the pre-silicon (FW integration on RTL simulation & FPGA platforms) and post-silicon (chip bring-up, FW integration & validation on reference design platform) phases. You will be responsible for analyzing & resolving issues reported by other teams or by customers. You will monitor the IEEE 802.15.4 standard evolutions and assess their impact on our firmware/software. You will progressively become the owner/expert of our IEEE 802.15.4 PHY or MAC layer. During your ramp-up, you will benefit from the experience & from the support of a well-established local team which has been working on other radio technologies for more than 15 years (mainly NFC & UWB) : 50+ connectivity SW engineers belonging to a broader team of 150+ connectivity R&D & customer support engineers covering all functional aspects of the software & hardware development cycle. You will join a global organization meaning that you will interact regularly with other worldwide teams such as the SoC HW design and the RF system teams in the US and the SW integration teams in India & in China. This is a unique opportunity to build the foundations of a new team, to become a key actor of its future success and to increase your responsibilities along with the team expansion. YOUR PROFILE : * MS in Software Engineering, Electrical Engineering, or related field * 10+ years of experience in embedded software development ideally within the semiconductor industry * Experience with customer interactions during product definition and design-in support (ideally in Smart Home or Internet of Things domain) would be plus * Deep understanding of microcontroller architectures and peripherals (especially ARM cores) * Good knowledge of real-time systems and RTOS * Advanced C-programming skills / ARM assembly language would be a plus * Experience with a wireless communication protocol (such as IEEE 802.15.4/Zigbee/Thread/Matter, Bluetooth or Wi-Fi) is desired * Experience with common serial communication buses (SPI, I²C, UART, SDIO, USB, PCIe) * Good knowledge on Radio Frequency transceiver basics * Experience with SoC bring-up would be a plus * Ability to read and understand mixed signal PCB schematics * Good analytical and troubleshooting/debugging skills * Proficient written and spoken English skills * Willingness to travel to the US, India or China from time to time WANT TO BE PART OF THIS EXCITING ADVENTURE? READY TO SHAPE THE FUTURE OF IOT CONNECTIVITY & TO CREATE A SMARTER WORLD? JOIN THE FUTURE OF INNOVATION. JOIN NXP. APPLY ONLINE!

Annonceur :  NXP Semiconductors

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